MediaTek has launched its new Dimensity 8450 chipset at the India Dimensity Summit. The event saw participation from OPPO, Vivo, Motorola, Redmi, Realme, Infinix, Samsung, and Lava. It also marked one year of MediaTek Connect with a gaming tournament and a full showcase of MediaTek’s 5G chip lineup.
The Dimensity 8450 is built on a 4nm process and uses eight Arm Cortex-A725 cores with an all-big-core CPU setup. It includes 1 core with 1MB L2 cache, 3 cores with 512KB L2, and 4 cores with 256KB L2. It also has 6MB of L3 cache and 5MB of system-level cache. The GPU is a Mali-G720 MC7.
For AI, the chipset integrates MediaTek’s NPU 880 with an Agentic AI Engine. It supports generative AI and large language models and can handle advanced AI workloads on-device. It supports 4K60 HDR (HLG) video with a Dual EIS engine for stabilization. Live Broadcast Booster improves face clarity during livestreams while using 7% less power.
For imaging, the Imagiq 1080 ISP supports up to 320MP sensors. It includes in-sensor zoom with QPD remozaic, zero-lag HDR, and 100% PDAF support. The chipset supports WQHD+ displays at 144Hz and dual-screen setups.
Gaming performance is improved with HyperEngine MAGT 3.0, which boosts touch response and improves 5G to Wi-Fi switching. The chip supports 3CC carrier aggregation with download speeds up to 5.17 Gbps. Other features include Wi-Fi 6E (2T2R), Bluetooth 5.4, LPDDR5X RAM up to 8533 Mbps, and UFS 4.0 storage with MCQ.
In India, OPPO will be the first to launch the Reno 14 Pro with the Dimensity 8450. A K-series model will follow soon.
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The post MediaTek Unveils Dimensity 8450 with Cortex-A725 Cores, 320MP Camera Support, 4K60 HDR & HyperEngine 3.0 for Gaming and AI appeared first on Gizmochina.
