Honor is preparing to launch the X70 smartphone in China on July 15. The device, identified as model number MTN-AN10 on China’s 3C certification platforms, has now appeared on Geekbench, confirming key performance details.
The benchmark confirms that the X70 runs on the Snapdragon 6 Gen 4 chipset. It will come with 12GB of RAM and Android 15. On Geekbench 6, it scored 1064 in the single-core test and 2998 in the multi-core test.
The Honor X70 will feature a 6.79-inch OLED display with a 1.5K resolution. It supports a 120Hz refresh rate, 3840Hz PWM dimming, a peak brightness of 6000 nits, and includes an in-screen fingerprint scanner. The top-end model will offer 12GB RAM and 512GB storage with wireless charging support.
Honor has confirmed that the phone will include an 8,300mAh battery. It supports 80W wired charging. The front camera will be 8 megapixels, and the rear will have a 50-megapixel sensor with optical image stabilization.
Other expected features include dual stereo speakers, NFC, and an infrared blaster. The device is rated IP68 and IP69 for dust and water resistance. It is 7.96mm thick and weighs 199 grams.
In other news, details about Honor’s upcoming flagship, the Honor Magic 8 Pro, have leaked. It is claimed to feature a 6.71-inch flat display, Snapdragon 8 Elite 2 chip, and a significantly larger 7,000mAh battery (up from 5,850mAh). Camera upgrades are expected, possibly retaining the 200MP telephoto lens with new sensors.
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